The last two days were not very exciting. Monday I needed to clearify a lot about the light production, as there were some misunderstandings about holding me in the loop during mold production.
The advantage: they were fast, the mold is already in hardening and erosion process.
The disadvantage: one day of fear, that they could have used the wrong CAD files
It turned out, that the files they used, were indeed slightly different from my final design. But with small adaptions in the assembly process it will be manageable without doing any modifications on the mold. I will post some pictures of the mold production soon.
Furthermore I had to keep track of all the small sample deliveries. Some of them were out of stock, so we had to find different suppliers.
The SD-Cards arrived, they work ok on my computer, and can be read and written to. But unfortunately as now they are Chinese style, they have some protocol problems during reading of internal card information, like block-size and -count. So I could do some adaptions to the firmware of the SD-Card tester and our mainboard, or buy other cards – we still not decided about that.